60.60 Standard published Apr 23, 1997
IEC
International Standard
31.080.01 Semiconductor devices in general
Published
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
WITHDRAWN
IEC 60191-5:1987 ED1
PUBLISHED
IEC 60191-5:1997 ED2
60.60
Standard published
Apr 23, 1997