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IEC 60191-5:1987 ED1

Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.

Publication date:   Sep 15, 1987

General information

99.60   Withdrawal effective   Apr 23, 1997

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

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Scope

Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards.
Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to additional or new dimensions.

Life cycle

NOW

WITHDRAWN
IEC 60191-5:1987 ED1
99.60 Withdrawal effective
Apr 23, 1997

REVISED BY

PUBLISHED
IEC 60191-5:1997 ED2