IEC 60068-2-83 ED2

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Current stage: 30.99 CD approved for registration as DIS Feb 23, 2024

Next stage: TCDV Next stage date : Apr 30, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 19.040 Environmental testing | 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 60068-2-83 ED2
30.99 CD approved for registration as DIS
Feb 23, 2024