IEC 60068-2-83 ED2

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Current stage: 40.20 DIS ballot initiated: 12 weeks Aug 30, 2024

Next stage: PRVC Next stage date : Nov 22, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 19.040 Environmental testing | 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 60068-2-83 ED2
40.20 DIS ballot initiated: 12 weeks
Aug 30, 2024