IEC 60068-2-21:2006 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations. This edition includes the following significant technical changes with respect to the previous edition:
- Addition of torque severity for nominal thread diameter of 8 mm in Test Ud: torque in accordance with IEC 60252-2 (see table 5);
- Modification of substrate specification and mounting method describing lead-free solder in Test Ue (see Figure 5 and 8.3.3 et al.);
- Modification of test jig and test condition in Test Ue1: substrate bending test (see Figure 7 et al.);
- Change of pushing force from 10 N to 5 N in Test Ue3: shear test (see 8.5.3.2). The contents of the corrigendum of January 2012 have been included in this copy.
WITHDRAWN
IEC 60068-2-21:1999 ED5
WITHDRAWN
IEC 60068-2-21:2006 ED6
99.60
Withdrawal effective
Jul 8, 2021
WITHDRAWN
IEC 60068-2-21:2006/COR1:2012 ED6
PUBLISHED
IEC 60068-2-21:2021 ED7