HD 323.2.58 S1:1991

Environmental testing - Part 2: Tests - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Scope

Introduction: Test Td is applicable to Surface Mounting Devices (SMD) - Soldering tests applicable to other electrotechnical products are in HD 323-2-20 for which guidance is given in HD 323-2-44 and HD 323-2-54 The guidance for Test Td is given in appendix B - Terms and definitions from HD 323-2-20 have been used in this standard in the interests of consistancy but they will need to be reviewed later when Test T is revised - Specification writers will find in clause 7 a list of details to be considered for inclusion in specifications - Quantitatie procedures for evaluating the quality of soldering for SMD are under consideration - Object: To provide a standard procedure for determining the solderability resistance to dissolution of metallization and resistance to soldering heat of Surface Mounting Devices (SMD) (hereafter referred to as 'specimens') - The procedure uses a solder bath and is applicable only to specimens of products designed to withstand short-term immersion in molten solder