EN IEC 63378-3:2025

Name: EN IEC 63378-3:2025
Brand: CENELEC
SKU: EN IEC 63378-3:2025
Price: 34.29 EUR
Availability: InStock
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Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Publication date: Aug 14, 2025

General information

Current stage: 60.60 Standard published Jun 20, 2025

Originator: CENELEC

Owner: CLC/TC 47X

Type: European Norm

ICS: 31.080.01 Semiconductor devices in general

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Status: Published

PDF - €34.29

Languages: English

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Scope

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.

This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

Life cycle

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PUBLISHED
EN IEC 63378-3:2025
60.60 Standard published
Jun 20, 2025