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EN IEC 63378-3:2025

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis EN IEC 63378-3:2025

Publication date:   Aug 14, 2025

General information

60.60   Standard published   Jun 20, 2025

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.

This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

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PUBLISHED
EN IEC 63378-3:2025
60.60 Standard published
Jun 20, 2025




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