EN IEC 60749-37:2022

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Publication date:   Mar 16, 2023

Scope

<!-- NEW! -->IEC 60749-37:2022 is available as <a href="https://webstore.iec.ch/publication/79480">IEC 60749-37:2022 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:

- correction of a previous technical error concerning test conditions;

- updates to reflect improvements in technology.