EN 60749-37:2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer EN 60749-37:2008

Publication date:   Sep 5, 2008

General information

99.60   Withdrawal effective   Nov 16, 2025

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

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NOW

WITHDRAWN
EN 60749-37:2008
99.60 Withdrawal effective
Nov 16, 2025

REVISED BY

PUBLISHED
EN IEC 60749-37:2022




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