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EN 61191-3:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publication date:   Sep 25, 2006

General information

99.60   Withdrawal effective   Jul 4, 2020

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.240   Mechanical structures for electronic equipment

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Scope

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Life cycle

NOW

WITHDRAWN
EN 61191-3:1998
99.60 Withdrawal effective
Jul 4, 2020

REVISED BY

PUBLISHED
EN 61191-3:2017