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EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies EN 61191-3:2017

Publication date:   Dec 14, 2017

General information

60.60 Standard published   Sep 1, 2017

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.240   Mechanical structures for electronic equipment

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Scope

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).

This edition includes the following significant technical changes with respect to the previous edition:

a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 61191-3:1998

NOW

PUBLISHED
EN 61191-3:2017
60.60 Standard published
Sep 1, 2017