Withdrawn
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
WITHDRAWN
EN 61191-3:1998
99.60
Withdrawal effective
Jul 4, 2020
PUBLISHED
EN 61191-3:2017