EN 61190-1-3:2002

Name: EN 61190-1-3:2002
Brand: CENELEC
SKU: EN 61190-1-3:2002
Price: 50.63 EUR
Availability: InStock
Rating: 5 (66 reviews)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publication date: Aug 10, 2006

General information

Current stage: 99.60 Withdrawal effective May 1, 2010

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.190 Electronic component assemblies

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Status: Withdrawn

PDF - €50.63

Languages: English

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Scope

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
EN 61190-1-3:2002
99.60 Withdrawal effective
May 1, 2010

REVISED BY

WITHDRAWN
EN 61190-1-3:2007