EN 61190-1-2:2002

Name: EN 61190-1-2:2002
Brand: CENELEC
SKU: EN 61190-1-2:2002
Price: 41.76 EUR
Availability: InStock
Rating: 5 (57 reviews)

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Publication date: Aug 10, 2006

General information

Current stage: 99.60 Withdrawal effective May 1, 2010

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.190 Electronic component assemblies

Buying

Status: Withdrawn

PDF - €41.76

Languages: English

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Scope

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
EN 61190-1-2:2002
99.60 Withdrawal effective
May 1, 2010

REVISED BY

WITHDRAWN
EN 61190-1-2:2007