0

EN 61190-1-2:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly EN 61190-1-2:2002

Publication date:   Aug 10, 2006

General information

99.60   Withdrawal effective   May 1, 2010

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
EN 61190-1-2:2002
99.60 Withdrawal effective
May 1, 2010

REVISED BY

WITHDRAWN
EN 61190-1-2:2007




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version