99.60 Withdrawal effective Jan 3, 2025
CENELEC
European Norm
31.080.01 Semiconductor devices in general
Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
WITHDRAWN
EN 60749-39:2006
99.60
Withdrawal effective
Jan 3, 2025
PUBLISHED
EN IEC 60749-39:2022