99.60 Withdrawal effective Nov 16, 2025
CENELEC
European Norm
31.080.01 Semiconductor devices in general
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
WITHDRAWN
EN 60749-37:2008
99.60
Withdrawal effective
Nov 16, 2025
PUBLISHED
EN IEC 60749-37:2022