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EN 60749-21:2005

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability EN 60749-21:2005

Publication date:   Aug 10, 2006

General information

99.60 Withdrawal effective   May 12, 2014

CENELEC

CLC/SR 47 Semiconductor devices

European Norm

31.080   Semiconductor devices

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Scope

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Life cycle

NOW

WITHDRAWN
EN 60749-21:2005
99.60 Withdrawal effective
May 12, 2014

REVISED BY

PUBLISHED
EN 60749-21:2011