Menu

0

EN 60191-6-4:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Publication date:   Aug 10, 2006

General information

60.60   Standard published   Jul 10, 2003

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

Buying

  Published

PDF - €36.35

  English  



Buy

Scope

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Life cycle

NOW

PUBLISHED
EN 60191-6-4:2003
60.60 Standard published
Jul 10, 2003