Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) EN 60191-6-4:2003
Publication date:
Aug 10, 2006
General information
60.60Standard publishedJul 10, 2003
CENELEC
CLC/SR 47D
Mechanical standardization of semiconductor devices