0

EN 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage EN 60191-6-19:2010

Publication date:   Sep 16, 2010

General information

60.60   Standard published   May 21, 2010

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

Buying

Published

Language in which you want to receive the document.

Scope

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Life cycle

NOW

PUBLISHED
EN 60191-6-19:2010
60.60 Standard published
May 21, 2010




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version