Menu

0

EN 60191-6-13:2007

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Publication date:   Apr 30, 2008

General information

99.60 Withdrawal effective   Nov 1, 2019

CENELEC

CLC/SR 47D Mechanical standardization of semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

Buying

  Withdrawn

PDF - €29.80

  English  



Buy

Scope

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ('FBGA' hereafter) and Fine-pitch Land Grid Array ('FLGA' hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

Life cycle

NOW

WITHDRAWN
EN 60191-6-13:2007
99.60 Withdrawal effective
Nov 1, 2019

REVISED BY

PUBLISHED
EN 60191-6-13:2016