EN 60068-2-83:2011

Name: EN 60068-2-83:2011
Brand: CENELEC
SKU: EN 60068-2-83:2011
Price: 55.53 EUR
Availability: InStock
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Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Publication date: Dec 16, 2011

General information

Current stage: 60.60 Standard published Oct 14, 2011

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 19.040 Environmental testing | 31.190 Electronic component assemblies

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Status: Published

PDF - €55.53

Languages: English

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Scope

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Life cycle

NOW

PUBLISHED
EN 60068-2-83:2011
60.60 Standard published
Oct 14, 2011

REVISED BY

IN_DEVELOPMENT
prEN IEC 60068-2-83:2024