IEC 62047-22:2014 ED1

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates IEC 62047-22:2014 ED1

Publication date:   Jun 19, 2014

General information

60.60 Standard published   Jun 19, 2014


TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices



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IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.

Life cycle


IEC 62047-22:2014 ED1
60.60 Standard published
Jun 19, 2014