IEC 62047-18:2013 ED1

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials IEC 62047-18:2013 ED1

Publication date:   Jul 17, 2013

General information

60.60 Standard published   Jul 17, 2013


TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices



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IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Life cycle


IEC 62047-18:2013 ED1
60.60 Standard published
Jul 17, 2013