IEC 62047-17:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films IEC 62047-17:2015 ED1

Publication date:   Mar 5, 2015

General information

60.60 Standard published   Mar 5, 2015


TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices



Language in which you want to receive the document.


IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

Life cycle


IEC 62047-17:2015 ED1
60.60 Standard published
Mar 5, 2015