IEC 62047-2:2006 ED1

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials IEC 62047-2:2006 ED1

Publication date:   Aug 15, 2006

General information

60.60 Standard published   Aug 15, 2006


TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices



Language in which you want to receive the document.


Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Life cycle


IEC 62047-2:2006 ED1
60.60 Standard published
Aug 15, 2006