IEC 60749-15:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Publication date:   Feb 7, 2003

General information

99.60 Withdrawal effective   Oct 28, 2010

IEC

TC 47 Semiconductor devices

International Standard

31.080.01   Semiconductor devices in general

Buying

Revised

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Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Life cycle

PREVIOUSLY

Replaces
IEC PAS 62174:2000 ED1

NOW

WITHDRAWN
IEC 60749-15:2003 ED1
99.60 Withdrawal effective
Oct 28, 2010

REVISED BY

WITHDRAWN
IEC 60749-15:2010 ED2