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Process management for avionics - Electronics design - Part 1: Electrical signal properties, naming conventions and interface control document (ICD)

60.60 Standard published

TC 107

Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan

60.60 Standard published

TC 107

Process management for avionics - Defining and performing highly accelerated tests in aerospace systems - Application guide

60.60 Standard published

TC 107

Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

60.60 Standard published

TC 107

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

60.60 Standard published

TC 107

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components

60.60 Standard published

TC 107

Information technology - Sensor network - Guidelines for design in the aeronautics industry: Active air-flow control

60.60 Standard published

ISO/IEC JTC 1/SC 41

Information technology — Sensor networks — Use cases of aeronautics industry: Active Air-flow Control

60.60 Standard published

ISO/IEC JTC 1/SC 41