IEC TS 62647-2:2012 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin IEC TS 62647-2:2012 ED1

Publication date:   Nov 29, 2012

General information

60.60 Standard published   Nov 29, 2012

IEC

TC 107

Technical Specification

03.100.50   Production. Production management | 31.020   Electronic components in general | 49.060   Aerospace electric equipment and systems

Buying

Published

Language in which you want to receive the document.

Scope

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62647-2:2011 ED1

NOW

PUBLISHED
IEC TS 62647-2:2012 ED1
60.60 Standard published
Nov 29, 2012

REVISED BY

ABANDON
IEC TS 62647-2 ED2