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IEC TS 62647-4:2018 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling IEC TS 62647-4:2018 ED1

Publication date:   Apr 10, 2018

General information

60.60 Standard published   Apr 16, 2018

IEC

TC 107

Technical Specification

03.100.50   Production. Production management | 31.020   Electronic components in general | 49.060   Aerospace electric equipment and systems

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Scope

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

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PUBLISHED
IEC TS 62647-4:2018 ED1
60.60 Standard published
Apr 16, 2018