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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

60.60 Standard published

TC 107

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

60.60 Standard published

TC 107

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

60.60 Standard published

TC 107

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components

60.60 Standard published

TC 107