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IEC 61189-3-720 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards IEC 61189-3-720 ED1

General information

20.99 WD approved for registration as CD   Dec 6, 2024

CD    Feb 28, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-720 ED1
20.99 WD approved for registration as CD
Dec 6, 2024