prEN IEC 63761

Thermography test method for defects circuit interconnection defects

General information

10.99   New project approved   Aug 31, 2026

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
prEN IEC 63761
10.99 New project approved
Aug 31, 2026