Menu

0

prEN IEC 63609-3

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples

General information

10.99   New project approved   Nov 25, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
prEN IEC 63609-3
10.99 New project approved
Nov 25, 2024