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prEN IEC 63609-2

Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites prEN IEC 63609-2

General information

10.99 New project approved   Nov 11, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
prEN IEC 63609-2
10.99 New project approved
Nov 11, 2024