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prEN IEC 63609-2

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements prEN IEC 63609-2

General information

10.99   New project approved   Nov 11, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

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IN_DEVELOPMENT
prEN IEC 63609-2
10.99 New project approved
Nov 11, 2024




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