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prEN IEC 63546-1

Required specification of package substrates for advanced semiconductor packaging - Part 1: Current-induced quality test method for package substrate prEN IEC 63546-1

General information

10.99   New project approved   Jul 8, 2024

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

Life cycle

NOW

IN_DEVELOPMENT
prEN IEC 63546-1
10.99 New project approved
Jul 8, 2024




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