prEN IEC 63378-4:2026

Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

Publication date:   Feb 13, 2026

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40.60   Close of voting   May 8, 2026

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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prEN IEC 63378-4:2026
40.60 Close of voting
May 8, 2026