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prEN IEC 63378-2-2:2026

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages prEN IEC 63378-2-2:2026

Publication date:   Feb 13, 2026

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40.60   Close of voting   May 8, 2026

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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prEN IEC 63378-2-2:2026
40.60 Close of voting
May 8, 2026




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