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prEN IEC 63215-4

Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices

General information

30.98   Project deleted   Jun 25, 2026

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

Life cycle

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prEN IEC 63215-4
30.98 Project deleted
Jun 25, 2026