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prEN IEC 62878-2-604

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

General information

10.99   New project approved   Mar 3, 2025

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
prEN IEC 62878-2-604
10.99 New project approved
Mar 3, 2025