prEN IEC 62878-2-604

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module prEN IEC 62878-2-604

Current stage: 10.99 New project approved Mar 3, 2025

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

IN_DEVELOPMENT
prEN IEC 62878-2-604
10.99 New project approved
Mar 3, 2025

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