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prEN IEC 61190-1-3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

General information

10.99   New project approved   Jan 13, 2025

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

Life cycle

PREVIOUSLY

PUBLISHED
EN IEC 61190-1-3:2018

NOW

IN_DEVELOPMENT
prEN IEC 61190-1-3
10.99 New project approved
Jan 13, 2025