prEN IEC 61190-1-3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications prEN IEC 61190-1-3

Current stage: 10.99 New project approved Jan 13, 2025

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.190 Electronic component assemblies

IN_DEVELOPMENT
prEN IEC 61190-1-3
10.99 New project approved
Jan 13, 2025

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version