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prEN IEC 61189-3-302:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) prEN IEC 61189-3-302:2024

Publication date:   Oct 4, 2024

General information

40.20 DIS ballot initiated: 12 weeks   Oct 4, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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prEN IEC 61189-3-302:2024
40.20 DIS ballot initiated: 12 weeks
Oct 4, 2024