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prEN 63011-1:2017

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology prEN 63011-1:2017

General information

40.98   Project deleted   May 15, 2018

CENELEC

CLC/SR 47A Integrated circuits

European Norm

Scope

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Life cycle

NOW

ABANDON
prEN 63011-1:2017
40.98 Project deleted
May 15, 2018




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