prEN 50XXX

BS 6221 - Printed wiring boards - Part 3: Guide for the design and use of printed wiring boards - Revision clause 8.2: Flatness of electronic assemblies prEN 50XXX

General information

30.98 Project deleted   Dec 16, 1990

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

Scope

This proposed work will provide information on the causes of warp of elctronic assemblies together with guidance on the methods which may be adopted to reduce the risk of it occuring. Some guidance may be provided on reduction of warp once it has occured.

Life cycle

NOW

ABANDON
prEN 50XXX
30.98 Project deleted
Dec 16, 1990

Relations

Adopted from BT(GB/NOT)20 IDENTICAL