Menu

0

IEC TR 63378-1:2021 ED1

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Publication date:   Dec 14, 2021

General information

60.60   Standard published   Dec 14, 2021

IEC

TC 47/SC 47D

Technical Report

31.080.01   Semiconductor devices in general

Buying

  Published

PDF - €139.15

  English  



Buy

Scope

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

Life cycle

NOW

PUBLISHED
IEC TR 63378-1:2021 ED1
60.60 Standard published
Dec 14, 2021