Menu

0

IEC TR 62453-502:2009 ED1

Field device tool (FDT) interface specification - Part 502: Communication implementation for common object model - IEC 61784 CPF 2

Publication date:   Aug 18, 2009

General information

99.60 Withdrawal effective   Jun 15, 2017

IEC

TC 65/SC 65E

Technical Report

25.040.40   Industrial process measurement and control | 35.100.05   Multilayer applications | 35.110   Networking

Buying

  Replaced

PDF - €181.50

  English  



Buy

Scope

IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM), also based on CIPTM, is defined in [13]. It neither contains the FDT specification nor modifies it.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62453-1:2006 ED1

WITHDRAWN
IEC PAS 62453-2:2006 ED1

WITHDRAWN
IEC PAS 62453-3:2006 ED1

WITHDRAWN
IEC PAS 62453-4:2006 ED1

WITHDRAWN
IEC PAS 62453-5:2006 ED1

NOW

WITHDRAWN
IEC TR 62453-502:2009 ED1
99.60 Withdrawal effective
Jun 15, 2017

REVISED BY

PUBLISHED
IEC TR 62453-51-20:2017 ED1