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IEC PAS 62647-23:2011 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

Publication date:   Jul 28, 2011

General information

99.60 Withdrawal effective   Oct 7, 2013

IEC

TC 107

Publicly Available Specification

03.100.50   Production. Production management | 31.020   Electronic components in general | 49.060   Aerospace electric equipment and systems

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  English  



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Scope

IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.

Life cycle

NOW

WITHDRAWN
IEC PAS 62647-23:2011 ED1
99.60 Withdrawal effective
Oct 7, 2013

REVISED BY

PUBLISHED
IEC TS 62647-23:2013 ED1